The surfaces can been polished on one or both sides with high roughness. Custom wafers can be supplied to special thicknesses with tight tolerances. Edges can be optically polished or rounded. Wafer cassette packaging available.
Specifications
Material
BK7 , UV Fused Silica, CaF2, MgF2, Quartz, Sapphire, Silicon, YAG,,ZnSe, ZnS, etc
Diameter Tolerance
+0.0/-0.1mm
Thickness tolerance
¡À0.05mm
Clear Aperture
>80%
Parallelism
<3 min
Surface Quality
10-5 scratch and dig
Wavefront Distortion
¦Ë/4 per 25mm at 632nm
Bevel
< 0.1mm¡Á45¡ã
Part No.
Size mm
Thicknessmm
UTB151
BK7
¦µ15
0.15
10-5
UTF151
Fused Silica
UTC151
CaF2
UTM151
MgF2
UTSA151
Sapphire
UTSI151
Silicon
UTY151
YAG
UTZE151
ZnSe
UTZS151